BS IEC 63011-2:2018
Current
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Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
Hardcopy , PDF
English
01-24-2019
IEC63011-2:2018provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
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