DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - DATA DICTIONARY

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2001

Publisher

British Standards Institution

Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. It also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die.

Committee	EPL/547
DevelopmentNote	Also numbered as ES 59008-6-2. (05/2001) Inactive for the new design. (02/2009)
DocumentType	Standard
Pages	26
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
ES 59008-6-2 : 2001	Identical

ES 59008-6-1 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT
EN 61360-4:2005/corrigendum:2005	STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC COMPONENTS - PART 4: IEC REFERENCE COLLECTION OF STANDARD DATA ELEMENT TYPES AND COMPONENT CLASSES
ES 59008-3 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS
ES 59008-1 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS
ES 59008-2 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY