BS QC 400000:1990

National foreword
Committees responsible
Section One - Scope
1. Scope
Section Two - General
2. General
2.1 Related documents
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
Section Three. Quality assessment procedures
3. Quality assessment procedures
3.1 Qualification Approval/Quality Assessment Systems
3.2 Primary Stage of Manufacture
3.3 Structurally Similar Components
3.4 Qualification Approval Procedures
3.5 Quality Conformance Inspection
3.6 Alternative test methods
3.7 Unchecked parameters
Section Four. Test and measurement procedures
4. Test and measurement procedures
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and check of dimensions
4.5 Resistance
4.6 Insulation resistance (insulated styles only)
4.7 Voltage proof
4.8 Variation of resistance with temperature
4.9 Reactance
4.10 Non-linear properties
4.11 Voltage coefficient
4.12 Noise
4.13 Overload
4.14 Temperature rise
4.15 Robustness of the resistor body
4.16 Robustness of terminations
4.17 Solderability
4.18 Resistance to soldering heat
4.19 Rapid change of temperature
4.20 Bump
4.21 Shock
4.22 Vibration
4.23 Climatic sequence
4.24 Damp heat, steady state
4.25 Endurance
4.26 Accidental overload test (for low power non-
      wirewound resistors only)
4.27 Single-pulse high-voltage overload test
4.28 Periodic pulse high-voltage overload test
4.29 Component solvent resistance
4.30 Solvent resistance of marking
4.31 Mounting (for chip resistors only)
4.32 Adhesion
4.33 Bond strength of the end face plating
Appendix
A. Interpretation of sampling plans and procedures as
      described in IEC Publication 410 for use within
      the IEC Quality Assessment System for Electronic
      Components
B. Rules for the preparation of detail specifications
      for capacitors and resistors for electronic
      equipment
C. Example of a test equipment for the periodic pulse
      high-voltage overload test

Describes fixed resistors for use in electronic equipment. Establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications for qualification approval and for quality assessment systems for electronic components.