CECC 63000 : 84 AMD 5

Applies to Film and Hybrid Integrated Circuits (F&HICs) - both passive and active as defined in IEC 147-0B: second supplement to Publication 147-0. Includes part-completed F&HICs supplied to customers for subsequent processing, and to chip carrier circuits with more than one chip, provided that they, as separate products, have been interconnected by film interconnection techniques. Does not cover printed boards but is applicable to F&HICs which may include them. Defines quality assessment procedures and methods for electrical, climatic and mechanical testing and describes requirements to be applied to release of products using either qualification approval procedures or capability approval procedures.