CECC 75101-807 : 1994
Withdrawn
MODULAR TWO-PART CONNECTORS FOR PRINTED BOARDS AND BACKPLANES, GRIDOF 2.5 mm - ACCORDING TO IEC 917 (DETAIL SPECIFICATION)
01-12-2013
06-02-2016
Foreword
Preface
1 General data
1.l Recommended method of mounting
1.2 Minimum and maximum number of contacts
1.3 Ratings and characteristics
1.4 Related documents
1.5 Marking
1.6 Ordering Information
2 Characteristics
2.1 Climatic category
2.2 Electrical
2.3 Mechanical
3 Dimensional information
3.1 Drawings and dimensions
4 Test schedule
4.1 General
4.2 Test schedule tables
5 Quality assessment procedures
5.1 Qualification approval testing
5.2 Quality conformance inspection
5.3 Delayed delivery, re-inspection
ANNEX A (normative): Test phase BP3.2: Corrosion,
industrial atmosphere
Gives detail specification for modular two-part connectors for printed boards and backplanes, grid of 2.5 mm, according to IEC 60917.
| Committee |
SR 48B
|
| DocumentType |
Standard
|
| PublisherName |
Cenelec Electronic Components Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. CECC 75101-807:1994 | Identical |
| EN 175100 : 1992 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: TWO PART AND EDGE SOCKET CONNECTORS FOR PRINTED BOARD APPLICATIONS |
| IEC 60512-8:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60512-6:1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests |
| IEC 60512-7:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests |
| IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| ISO 468:1982 | Surface roughness — Parameters, their values and general rules for specifying requirements |
| IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
| IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
| IEC 60512-9:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests |
| IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
| IEC 60512-1:2001 | Connectors for electronic equipment - Tests and measurements - Part 1: General |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |