CEI 56-44 : 2000
Withdrawn
DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
Hardcopy , PDF
English
01-01-2000
06-01-2021
Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
screening programme
6 General information about the reliability stress
screening process
7 Analysis of the benefits of the reliability stress
screening process
8 Characteristics of a successful reliability stress
screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress concerning
process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
stress screening process
Annex A (informative) - RSS of repairable items produced
in lots
Annex B (informative) - RSS of electronic components
Gives a guide to reliability stress screening process for electronic hardware.
| Committee |
CT 56
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60300-3-7:1999 | Identical |
| CEI 56-46 : 2005 | DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| MIL-STD-750 Revision F:2011 | Test Methods for Semiconductor Devices |
| IEC 61163-1:2006 | Reliability stress screening - Part 1: Repairable assemblies manufactured in lots |
| IEC 61163-2:1998 | Reliability stress screening - Part 2: Electronic components |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
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