CEI CECC 200025 : 2000
Withdrawn
PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
Hardcopy , PDF
English
01-01-2000
07-01-2020
Introduction
1 General requirements
2 Quality requirements of the process sequence
3 Specialist Assembly Facility documentation requirements
4 Audits
5 Corrective actions and failure analysis
6 Interface between Assembly Facility and Customer
7 Training
8 Notification of modifications to capability
Annexes
Annex A - Definitions
Annex B - Form and content of process specifications
Annex C - Form and content of Process Manuals
Annex D - Format of first page of Process Approval report
Annex E - Example abstract of description of Process Approval
Annex F - Audit check list (technical)
Annex G - Abbreviations
Defines the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the operation of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assessed quality.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-1 (01/2003)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CECC 200025 : 1998 | Identical |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN ISO 9002:1994/AC:1997 | QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
| CECC 00114-5 : 94 AMD 2 | PROCESS APPROVAL OF SPECIALIST CONTRACTORS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY |
| EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| CECC 00200 : 2002 | REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| CECC 200 012 : 1995 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD DESIGNED FACILITIES |
| CECC 00401 : 91 AMD 1 | GLOSSARY OF ABBREVIATIONS, TERMS AND DEFINITIONS OF THE CECC SYSTEM |
| EN ISO 9000:2015 | Quality management systems - Fundamentals and vocabulary (ISO 9000:2015) |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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