CEI CECC 23200-801 : 1998
Withdrawn
CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE-SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
Hardcopy , PDF
English
01-01-1998
07-01-2020
1 GENERAL
2 CAPABILITY QUALIFYING COMPONENT
3 CAPABILITY APPROVAL
4 CAPABILITY TEST PROGRAMME
5 ADDITIONAL CAPABILITY
6 TRACEABILITY
Annex A - Suitable test pattern for marking inks
Annex B - Suitable test pattern for solder masks
Annex C - Suitable test pattern for bonded heatsinks
Annex D - Edge connector imperfections
Annex E - CTP subdivision for thermal shock
Annex F - Circumferential defects in plated-through holes
Annex G - Determination of characteristic impedance by TDR
Pertains to rigid single and double-sided printed boards with plated-through holes, made with materials and surface finishes.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-1000. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CECC 23200-801 : 1998 | Identical |
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