CEI CLC/TR 62258-3 : 2007

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of bare
   die and wafers
10 Good practice for automated handling during assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Pertains to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.