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CEI EN 60068-2-20 : 2009

Superseded

Superseded

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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS

Available format(s)

Hardcopy , PDF

Language(s)

English - Italian

Published date

01-01-2009

Superseded date

07-14-2025

US$82.29
Excluding Tax where applicable
Summarise this standard

1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of
  wire and tag terminations
5 Test Tb: Resistance to
  soldering heat
Annex A (informative) - Example
        of apparatus for
        accelerated steam ageing
        process
Annex B (normative) - Specification
        for flux constituents
Bibliography
Annex ZA (normative) - Normative
         references to international
         publications with their
         corresponding European
         publications

Gives procedures for determining The solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

Committee
CT 309
DevelopmentNote
Classificazione CEI 91-58. Supersedes CEI 50-8/4. (03/2009)
DocumentType
Standard
Pages
40
PublisherName
Comitato Elettrotecnico Italiano
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
EN 60068-2-20:2008 Identical
IEC 60068-2-20:2008 Identical

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A newer version of this standard is available.

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US$82.29
Excluding Tax where applicable