CEI EN 60068-2-20 : 2009
Superseded
View Superseded by
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
Hardcopy , PDF
English - Italian
01-01-2009
07-14-2025
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of
wire and tag terminations
5 Test Tb: Resistance to
soldering heat
Annex A (informative) - Example
of apparatus for
accelerated steam ageing
process
Annex B (normative) - Specification
for flux constituents
Bibliography
Annex ZA (normative) - Normative
references to international
publications with their
corresponding European
publications
Gives procedures for determining The solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-58. Supersedes CEI 50-8/4. (03/2009)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 60068-2-20:2008 | Identical |
| IEC 60068-2-20:2008 | Identical |
A newer version of this standard is available.
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