CEI EN 60068-2-54 : 2007
Superseded
View Superseded by
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
Hardcopy , PDF
English - Italian
01-01-2007
10-01-2017
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. General description of the test
5. Description of the test apparatus
6. Preconditioning
7. Materials
8. Procedure
9. Presentation of results
10. Information to be given in the relevant
specification
Annex A (normative) - Equipment specification
Annex B (informative) - Guide to the use of the
wetting balance for solderability
testing
Bibliography
Annex ZA (normative) - Normative references
to international publications with
their corresponding European
publications
Describes the outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-41. Supersedes CEI 50-8/1:1998. (02/2007) Superseded by CEI EN 60068-2-69 but remains current and will be withdrawn on 11-04-2020. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-54:2006 | Identical |
| EN 60068-2-54:2006 | Identical |
A newer version of this standard is available.
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