CEI EN 60068-2-69:2007
Superseded
Superseded
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Environmental Tests Part 2-69: Tests - Test Te: Solderability test of electronic components for surface mount devices (SMDs) by the wetting balance method
Published date
11-01-2007
Publisher
Superseded date
07-17-2025
Superseded by
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This standard is part of the IEC/EN 60068 series for environmental tests and in particular deals with the solderability of SMD components with the wetting balance method.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 60068-2-69:2007 | Identical |
| IEC 60068-2-69:2007 | Identical |
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