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CEI EN 60191-6-2 : 2002

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and
  1,00 mm pitch Reference characters and drawings
5 Column terminal packages, 1,50 mm, 1,27 mm
  and 1,00 mm pitch Reference characters and drawings
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-1002. (07/2015)
DocumentType
Standard
Pages
22
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 60191-6-2:2002 Identical
IEC 60191-6-2:2001 Identical

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