CEI EN 60512-12-7 : 2002
Current
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD
Hardcopy , PDF
English
01-01-2002
FOREWORD
1. SCOPE AND OBJECT
2. NORMATIVE REFERENCES
3. PREPARATIONS OF THE SPECIMEN
4. PROCEDURE
5. FINAL MEASUREMENT
6. REQUIREMENTS
7. DETAILS TO BE SPECIFIED
ANNEX ZA (NORMATIVE) - NORMATIVE REFERENCES TO
INTERNATIONAL PUBLICATIONS
WITH THEIR CORRESPONDING
EUROPEAN PUBLICATIONS
Describes the standard test method to access the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.
| Committee |
CT 48
|
| DevelopmentNote |
Classificazione CEI 48-71. (10/2002)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60512-12-7:2001 | Identical |
| IEC 60512-12-7:2001 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| HD 323.2.54 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST TA: SOLDERING - SOLDERABILITY TESTING BY THE WETTING BALANCE METHOD |
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