CEI EN 60749-21 : 2012
Superseded
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
Hardcopy , PDF
English
01-01-2012
04-20-2026
FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary
Bibliography
Defines a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-41. (08/2005) Supersedes CEI EN 60749. (05/2008)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60749-21:2011 | Identical |
| EN 60749-21:2011 | Identical |
A newer version of this standard is available.
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