CEI EN 61190-1-3 / A1 : 2011
Superseded
Superseded
Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Amendment of
Available format(s)
Hardcopy , PDF
Language(s)
English - Italian
Published date
07-01-2011
Publisher
Superseded date
01-15-2021
Excluding Tax where applicable
This variant modifies the CEI EN 61190-1-3: 2008-04 Standard relating to fastening materials for electronic assembly (alloys and fluxed solders for electronic welding).
| DocumentType |
Amendment
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
Summarise