CEI EN 62137-3 : 2012

1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting the applicable
  test method
6 Common subjects in each test method
7 Evaluation test method
Annex A (informative) - Condition of rapid
        temperature change
Annex B (informative) - Electrical continuity
        test for solder joint
Annex C (informative) - Torque shear strength
        test
Annex D (informative) - Monotonic bending
        strength test
Annex E (informative) - Cyclic steel ball drop
        strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Evaluation method for
        the fillet lifting phenomenon of a lead
        insertion type device solder joint
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.