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CEI EN 62258-6 : 2007

CEI EN 62258-6 : 2007

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-1031. (09/2015)
DocumentType
Standard
Pages
16
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 62258-6:2006 Identical
EN 62258-6 : 2006 Identical

EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats

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Hardcopy - English
PDF - English
Hardcopy - English
PDF - English
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