CEI EN IEC 60068-2-83:2025-08
Current
Environmental testing-Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Hardcopy , PDF
English
08-01-2025
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8327-0449-3
|
| Pages |
46
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-83:2025 | Identical |
| EN IEC 60068-2-83:2025 | Identical |
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