CEI EN IEC 60749-20:2020
Current
Hardcopy , PDF
English
12-01-2020
Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-8727-9
|
| Pages |
36
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-20:2020 | Identical |
| IEC 60749-20:2020 | Identical |
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