Name: CEI EN IEC 61188-6-3:2025-03 - Circuit boards and circuit board assemblies - Design and use – Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Brand: Comitato Elettrotecnico Italiano

Circuit boards and circuit board assemblies - Design and use – Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

03-01-2025

Publisher

Comitato Elettrotecnico Italiano

Add to Watchlist

US$121.25

Excluding Tax where applicable

This part of IEC 61188 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.

Committee	CT 309
DocumentType	Standard
ISBN	978-2-8327-0069-3
Pages	40
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 61188-5-3 : 2008 CEI EN 61188-5-8 : 2008 CEI EN 61188-5-2 : 2004 CEI EN 61188-5-6 : 2004 CEI EN 61188-5-5 : 2008 CEI EN 61188-5-4 : 2008

Standards	Relationship
IEC 61188-6-3:2024	Identical
EN IEC 61188-6-3:2025	Identical

Summarise

ChatGPT Perplexity

US$121.25

Excluding Tax where applicable

Product format

I agree to the DRM document license rules apply against the PDF selection made.

Please confirm that you agree to the document license rules for this document.

I agree to the document license rules .

Please confirm that you agree to the document license rules for this document.

Shopping Cart

CEI EN IEC 61188-6-3:2025-03

Circuit boards and circuit board assemblies - Design and use – Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Abstract

General Product Information

International Equivalents

Industry

Sub-Industry