CEI EN IEC 61189-2-807:2022
Current
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
06-01-2022
Publisher
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-1019-8
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
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