CEI EN IEC 61760-3:2021
Current
Surface mounting technology Part 3: Standard method for the specification of components for throughhole reflow (THR) soldering
Hardcopy , PDF
English
10-01-2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9294-5
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61760-3:2021 | Identical |
| EN IEC 61760-3:2021 | Identical |
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