CEI EN IEC 62148-21:2022-02
Current
Fiber Optic Active Components and Devices - Package and Interface Standards Part 21: Electrical Interface Design Guidelines for Photonic Integrated Circuits (PICs) Using Silicon Fine-Pitch Grids in the Form of Both Spheres (S-FBGA) and Pads (S-FLGA)
Hardcopy , PDF
English
02-01-2022
The Standard contains electrical interface design guidelines for photonic integrated circuit (PIC) packages that use silicon fine-pitch grids in the form of both spheres (Silicon-Fine Grid Ball Array: S-FBGA) and pads (Silicon-Fine Land Grid Array: S-FLGA).
| Committee |
CT 86
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9723-0
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 62148-21:2021 | Identical |
| IEC 62148-21:2021 | Identical |
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