CEI EN IEC 62769-6:2023
Current
Current
Field Device Integration (FDI®) Part 6: FDI Technology Mappings
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
09-01-2023
Publisher
US$55.96
Excluding Tax where applicable
This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®1) standard.
| Committee |
CT 65
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-6477-5
|
| Pages |
16
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 62769-6:2023 | Identical |
| EN IEC 62769-6:2023 | Identical |
Summarise
US$55.96
Excluding Tax where applicable
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