CEI EN IEC 62878-2-603:2025-05
Current
Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
Hardcopy , PDF
English
05-01-2025
This part of IEC 62878 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8327-0240-6
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 62878-2-603:2025 | Identical |
| IEC 62878-2-603:2025 | Identical |
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