DI-MGMT-81772 Base Document:2009
Current
Lead-Free Control Plan (LFCP)
English
06-12-2009
Attains essential information from contractors on how they plan to manage the risk of lead-free solders or finishes used in their products during the program's lifecycle. Applies to all new contracts and solicitations that acquire electronic systems including weapons systems containing electronic components as well as rework or repair of electronic systems or components.
| DocumentType |
Standard
|
| Pages |
2
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
The Lead-Free Control Plan (LFCP) will be used to obtain essential information from contractors on how they plan to manage the risk of lead-free solders or finishes used in their products during the program\'s lifecycle.
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
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