DIN EN 60249-2-19 : 1993 AMD 2 1996
Withdrawn
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
01-12-2013
01-01-2009
Committees responsible
National foreword
Specification
1. Scope
2. Normative references
3. Materials and construction
4. Internal marking
5. Electrical properties
6. Non-electrical properties of the copper-clad sheet
7. Non-electrical properties of the base material
after complete removal of the copper foil
8. Packaging and marking
9. Acceptance testing
Tables
1. Electrical properties
2. Types, sizes and permitted number of imperfections
3. Pull-off and peel strength
4. Wetting conditions
5. Dimensional stability
6. Size tolerances for cut panels
7. Rectangularity of cut panels
8. Nominal thickness and tolerances of sheet excluding
metal foil
9. flammability
10. Glass transition temperature and cure factor
11. Thermal coefficient of expansion
modified epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Coverage includes internal marking, electrical properties, acceptance testing and nonelectrical properties of the copper clad sheet. Also includes detailed tables.
| DocumentType |
Standard
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60249-2-19:1992 | Identical |
| I.S. EN 60249-2-19:1996 | Identical |
| EN 60249-2-19 : 1993 AMD 2 1995 | Identical |
| BS EN 60249-2-19:1993 | Identical |
| UNE-EN 60249-2-19:1997 | Identical |