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DIN EN 60749-16:2003-09

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2003

Foreword
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance
8 Detail specification
9 Summary

Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

DocumentType
Standard
Pages
8
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current

Standards Relationship
UNE-EN 60749-16:2003 Identical
NBN EN 60749-16 : 2004 Identical
I.S. EN 60749-16:2003 Identical
IEC 60749-16:2003 Identical
BS EN 60749-16:2003 Identical
EN 60749-16:2003 Identical
NF EN 60749-16 : 2003 Identical

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