DIN EN 61192-4:2003-11
Withdrawn
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003
Hardcopy , PDF
German
11-01-2003
06-26-2022
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection technique
4.4 Interpretation of requirements
5 Process characterization
5.1 Wire preparation processes
5.2 Terminal mounting processes
5.3 Soldering terminal
5.4 Solderability
5.5 Preconditioning
5.6 Mechanical securing
6 Wire preparation attributes
6.1 Insulation stripping
6.2 Twisted strands
7 Connector pins and terminals
7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
8.1 Wire selection
8.2 Wire routing
8.3 Staking
8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
10.1 Post terminations
Figures
Table
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
| DevelopmentNote |
Supersedes DIN IEC 91-160-CD (12/2003)
|
| DocumentType |
Standard
|
| Pages |
29
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 61192-4:2002 | Identical |
| BS EN 61192-4:2003 | Identical |
| EN 61192-4:2003 | Identical |
| I.S. EN 61192-4:2003 | Identical |
| NF EN 61192-4 : 2003 | Identical |
| NBN EN 61192-4 : 2004 | Identical |
| UNE-EN 61192-4:2003 | Equivalent |
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