DIN EN 62047-18:2014-04
Current
Current
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2014
US$117.96
Excluding Tax where applicable
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| EN 62047-18:2013 | Identical |
| IEC 62047-18:2013 | Identical |
Summarise
US$117.96
Excluding Tax where applicable
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