DIN EN 62047-25:2014-05 (Draft)
Superseded
Superseded
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA (IEC 62047-25:2016)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2014
Superseded date
03-07-2021
US$136.55
Excluding Tax where applicable
| DocumentType |
Draft
|
| Pages |
38
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Superseded
|
| Standards | Relationship |
| IEC 62047-25:2016 | Identical |
Summarise
US$136.55
Excluding Tax where applicable
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