DIN IEC 60191-6-17:2007-10 (Draft)
Superseded
Superseded
View Superseded by
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: DESIGN GUIDE FOR STACKED PACKAGES AND INDIVIDUAL STACKABLE PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY PACKAGES (FBGA/FLGA)
Published date
01-12-2013
Superseded date
09-01-2011
Superseded by
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Dieser Teil von IEC 60191 enthält gemeinsame Gehäusezeichnungen und Abmessungen für gestapelte Gehäuse und individuell stapelbare FBGA und FLGA mit quadratischem Gehäuse.
| DocumentType |
Draft
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| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Superseded
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| SupersededBy |
Summarise
Sorry this product is not available in your region.