DIN IEC 60191-6-19:2008-03 (Draft)

Name: DIN IEC 60191-6-19:2008-03 (Draft) - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
Brand: German Institute for Standardisation (Deutsches Institut für Normung)

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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE

Published date

01-12-2013

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

Superseded date

10-01-2010

Superseded by

DIN EN 60191-6-19:2010-10

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Diese Norm legt die Kriterien für die Gehäuseverbiegung und die Messverfahren der Gehäuseverbiegung bei erhöhter Temperatur für BGA, FBGA und FLGA fest.

DocumentType	Draft
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Superseded
SupersededBy	DIN EN 60191-6-19:2010-10

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DIN IEC 60191-6-19:2008-03 (Draft)

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE

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