DIN IEC 60191-6-21:2009-02 (Draft)
Superseded
Superseded
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
Published date
01-12-2013
Superseded date
03-01-2011
Superseded by
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Dieser Teil von IEC 60191 (beinhaltet bzw.) legt Verfahren zur Messung der Masse von kleinen Gehäusen (SOP) fest, die der Bauform E nach IEC 60191-4 entsprechen.
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Draft
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| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Superseded
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| SupersededBy |
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