DIN IEC 60455-3-2 : 2000
Superseded
Superseded
View Superseded by
SPECIFICATION FOR SOLVENTLESS POLYMERISABLE RESINOUS COMPOUNDS USED IN ELECTRICAL INSULATION - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS; SHEET 2: FILLED EPOXY RESINOUS COMPOUNDS
Published date
01-01-2000
Superseded date
01-01-2004
Superseded by
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Vorwort
Einleitung
1 Anwendungsbereich
2 Anforderungen
3 Besondere Anforderungen
Anhang ZA (normativ) Normative Verweisungen auf
internationale Publikationen mit ihren
entsprechenden europ-ae-ischen Publikationen
| DevelopmentNote |
Supersedes DIN 46448-1, DIN 46448-1 E, DIN 46448-2 and DIN 46448-2 E (07/2002)
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| DocumentType |
Standard
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| HD 307.3.2 : 200S2 | Corresponds |
| VDE 0355-3-2:2004-01 | Corresponds |
| HD 307.3.2 : 200S2 | Identical |
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