DIN IEC 61190-1-2:2005-09 (Draft)

Name: DIN IEC 61190-1-2:2005-09 (Draft) - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
Brand: German Institute for Standardisation (Deutsches Institut für Normung)

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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

Published date

01-12-2013

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

Superseded date

11-01-2007

Superseded by

DIN EN 61190-1-2:2014-11

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DocumentType	Draft
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Superseded
SupersededBy	DIN EN 61190-1-2:2014-11

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DIN IEC 61190-1-2:2005-09 (Draft)

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

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