DIN IEC 61190-1-3:2005-09 (Draft)
Superseded
Superseded
View Superseded by
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
Published date
01-12-2013
Superseded date
11-01-2007
Superseded by
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| DevelopmentNote |
DRAFT AMD 1 issued in November 2008 is now superseded by DIN EN 61190-1-3. (04/2011)
|
| DocumentType |
Draft
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Superseded
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| SupersededBy |
Summarise
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