DIN IEC 61760-3:2008-09 (Draft)

Name: DIN IEC 61760-3:2008-09 (Draft) - SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
Brand: German Institute for Standardisation (Deutsches Institut für Normung)

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SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING

Published date

09-01-2008

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

Superseded date

12-01-2010

Superseded by

DIN EN 61760-3:2010-12

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Der Anwendungsbereich dieser Norm umfasst alle Spezifikationen von elektronischen Bauelementen, welche für die Durchsteckmontage mit Aufschmelzlötverfahren bestimmt sind.

DocumentType	Draft
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Superseded
SupersededBy	DIN EN 61760-3:2010-12

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DIN IEC 61760-3:2008-09 (Draft)

SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING

Abstract

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