DIN IEC 62047-13:2010-05 (Draft)
Superseded
Superseded
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SEMICONDUCTOR DEVICES - MICRO ELECTRO MECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
Published date
11-09-2012
Superseded date
10-01-2012
Superseded by
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| DocumentType |
Draft
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Superseded
|
| SupersededBy |
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Sorry this product is not available in your region.