DSCC 11018 : 0
Superseded
Superseded
View Superseded by
INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
Publisher
Superseded date
07-03-2026
Superseded by
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the requirements for inductors, SMD, chip.
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Superseded
|
| SupersededBy |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL-STD-1285 Revision D:2004 | Marking of Electrical and Electronic Parts |
Summarise
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