DSCC 25203:2024
Superseded
Superseded
View Superseded by
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION HARDENED, Gen3, 1 GBit, 32 M x 32, MAGNETORESISTIVE RAM (MRAM), MONOLITHIC SILICON
Published date
12-31-2024
Publisher
Superseded date
04-06-2026
Superseded by
Sorry this product is not available in your region.
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V).
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Superseded
|
| SupersededBy |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| ASTM F 1192 : 2024 | Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices |
| MIL-HDBK-780 Revision D:2004 | Standard Microcircuit Drawings |
| MIL-PRF-38535 Revision L:2018 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-HDBK-103 Revision AJ:2011 | List of Standard Microcircuit Drawings |
| MIL-STD-1835 Revision D:2004 | Electronic Component Case Outlines |
Summarise
Sorry this product is not available in your region.