EN 60068-2-58:1999
Withdrawn
Withdrawn
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published date
04-01-1999
Withdrawn date
01-01-2002
Sorry this product is not available in your region.
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| BS EN 60068-2-58:1999 | Equivalent |
| CEI EN 60068-2-58:2001 | Identical |
| BS EN 61290-3-1:2003 | Identical |
| UNE-EN 60068-2-58:2000 | Identical |
Summarise
Sorry this product is not available in your region.