EN 60068-2-58:2004
Withdrawn
Withdrawn
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published date
10-01-2004
Withdrawn date
09-01-2007
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Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 60068-2-58:2004 | Equivalent |
| BS EN 60068-2-58:2004 | Equivalent |
| UNE-EN 60068-2-58:2006 | Identical |
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