EN 60068-2-69:1996
Withdrawn
Withdrawn
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
Published date
01-11-1996
Withdrawn date
09-01-1996
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Summarise this standard
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Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CEI EN 60068-2-69:1997-10 | Identical |
| BS EN 60068-2-69:1996 | Equivalent |
| UNE-EN 60068-2-69:1997 | Identical |
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