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EN 60249-2-1 : 1994 AMD 4 2000

Withdrawn

Withdrawn

BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET - HIGH ELECTRICAL QUALITY

Published date

01-12-2013

Withdrawn date

02-01-2006

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FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
  complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
         quoted in this standard with the references of
         the relevant European publications

Provides requirements for properties of phenolic cellulose paper copper-clad laminated sheet, high electrical quality, in thicknesses of 0.5 mm up to 6.4 mm.

Committee
SR 91
DevelopmentNote
Supersedes HD 313.2.1 (05/2001)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

BS EN 60297-3-101:2004 Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series Subracks and associated plug-in units
EN 60297-3-101:2004 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units
I.S. EN 60297-3-101:2004 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT - DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 MM (19 IN) SERIES - PART 3-101: SUBRACKS AND ASSOCIATED PLUG-IN UNITS
CEI EN 60297-3-101 : 2005 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT - DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 MM (19 IN) SERIES - PART 3-101: SUBRACKS AND ASSOCIATED PLUG-IN UNITS

IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

Sorry this product is not available in your region.