EN 60249-2-10 : 1994 AMD 5 2000
Withdrawn
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
01-12-2013
02-01-2006
Foreword
Preface
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material
after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references of
the relevant European publications
Provides requirements for properties of epoxide non woven/woven glass reinforced copper clad laminated sheet of defined flammability, in thickness of 0.7 mm up to 3.2 mm. Includes internal marking, electrical properties, non-electrical properties of the copper clad sheet, non-electrical properties of the base material after complete removal of the copper foil, packaging and marking, and acceptance testing.
| Committee |
SR 91
|
| DevelopmentNote |
Supersedes HD 313.2.10 (07/2005)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60249-2-10:1987 | Identical |
| DIN EN 60249-2-10:2001-09 | Identical |
| PN EN 60249-2-10 : 2002 | Identical |
| I.S. EN 60249-2-10:1995 | Identical |
| NF EN 60249 2-10 : 96 AMD 5 2001 | Identical |
| NBN EN 60249 2-10 : 96 AMD 1 2001 | Identical |
| NEN 10249-2-10 : 1994 AMD 4 1996 | Identical |
| BS EN 60249-2-10:1994 | Identical |
| CEI EN 60249-2-10 : 2ED 2001 | Identical |
| NEN EN IEC 60249-2-10 : 1994 AMD 5 2001 | Identical |
| UNE-EN 60249-2-10:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |