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EN 60249-2-2 : 1994 AMD 5 2000

Withdrawn

Withdrawn

BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY

Published date

01-12-2013

Withdrawn date

02-01-2006

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FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material after
  complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
         quoted in this standard with the references of
         the relevant European publications

Provides requirements for properties of phenolic cellulose paper copper-clad laminated sheet, economic quality, in thicknesses of 0.5 mm up to 6.4 mm. Includes internal marking, packaging and marking.

Committee
SR 91
DevelopmentNote
Supersedes HD 313.2.2 (07/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

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I.S. EN 81-3:2000 SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - PART 3: ELECTRIC AND HYDRAULIC SERVICE LIFTS
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EN 81-2 : 1998 + A3 2009 SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - PART 2: HYDRAULIC LIFTS
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BS EN 81-3 : 2003 SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - PART 3: ELECTRIC AND HYDRAULIC SERVICE LIFTS
10/30216944 DC : 0 BS EN 81-22 - SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - LIFTS FOR TRANSPORT OF PERSONS AND GOODS - PART 22: ELECTRIC LIFTS WITH INCLINED PATH
DIN EN 81-1:2010-06 SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - PART 1: ELECTRIC LIFTS
DIN EN 81-1:2000-05 SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - PART 1: ELECTRIC LIFTS
UNE-EN 81-2:2001 SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF LIFTS - PART 2: HYDRAULIC LIFTS.

IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

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