EN 60749-15:2003
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Published date
04-17-2003
Withdrawn date
04-01-2006
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Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 60749-15:2003 | Equivalent |
| BS EN 60749-15:2003 | Equivalent |
| UNE-EN 60749-15:2003 | Identical |
| BS EN 60749-15:2003 | Identical |
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