EN 60749-15:2010
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Amended by
Published date
12-10-2010
Withdrawn date
12-01-2013
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IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.
| Committee |
CLC/SR 47
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 60749-15:2010 | Equivalent |
| BS EN 60749-15:2010 | Equivalent |
| UNE-EN 60749-15:2011 | Identical |
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